Description
Features
Specifications
Welding Method: Laser Solder Ball WeldingMachine Structure: Vertical, Fully Enclosed CabinetAutomation Level: Automated / In-line CapableInstallation Mode: Standalone Or In-line IntegrationSolder Ball Diameter Range: 70 μm – 2.0 Mm (Configurable)Welding Process: Non-contact Laser SolderingProcess Stability: High Repeatability And ConsistencyPositioning Method: Vision-guided Precision Alignment
Product Overview
The Vertical Solder Ball Welding Machine is a fully enclosed, high-precision laser soldering system designed for automated solder ball attachment in advanced electronic manufacturing. With a vertical cabinet structure, integrated vision system, and in-line workflow capability, the machine ensures stable process control, high repeatability, and a clean operating environment.
The system is suitable for mass production scenarios requiring high reliability, safety, and consistency, such as semiconductor packaging and precision microelectronics assembly.
Key Features
Vertical Enclosed Structure
Full cabinet design improves safety, process stability, and environmental control.
Vision-Guided Solder Ball Welding
Integrated vision system enables accurate positioning and real-time alignment correction.
Laser Soldering Technology
Non-contact laser welding ensures precise energy control and consistent solder joint quality.
FFU Clean Air Unit (Optional)
Supports cleanroom-compatible operation and reduces particle contamination.
In-Line Workflow Capability
Designed to support production line integration for automated, continuous operation.
Industrial Control System
Built-in industrial PC with intuitive HMI for recipe management and process monitoring.
Status Indicator Tower Light
Three-color signal light provides real-time machine status indication.
Vertical Solder Ball Welding Machine| Enclosed Laser System vision system soldering technology soldering system vertical cabinet 0
Vertical Solder Ball Welding Machine| Enclosed Laser System vision system soldering technology soldering system vertical cabinet 1
Typical Applications
Semiconductor packaging
IC and chip-level solder ball attachment
Microelectronics and sensor assembly
Automated high-volume soldering production
Notes
System configuration, laser source, vision modules, automation interfaces, and specifications can be customized according to customer requirements. If you need to obtain detailed information, please contact Xiamen Large Automation Technology Co,.Ltd.
- Solder ball attaching machine
- vertical solder ball attaching machine
Production Capacity:
10000
Delivery Timeframe:
Within 30 Days
Incoterms:
CFR - Cost and Freight
CIF - Cost, Insurance and Freight
Packaging Details:
TBA
More about
Xiamen Large Automation Technology Co,.Ltd.
200-500
Employees
50M - 100M
Sales volume (USD)
50%
% Export sales
Year
Established
Business type
- Industry / Manufacturer
Keywords
- Intelligent dispensing equipment
- water-based adhesive bonding equipment
- laser solder ball welding equipment
Contact and location
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Anna ********
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+86 8********
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Xia Men / 福建 (Fujian) | China