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Description
LCOG-0500S COG Bonding Machine<br><br>Usage: It’s a semiautomatic bonding machine with pre-bonding & final bonding function, <br>applicable to bond IC on LCD laminated with ACF<br>Product Dimension: 1~5.3”<br>Accuracy: Pre-bonding±2.5µm, final bonding±4µm<br>Capacity: 650pcs/h<br>Outline Dimension (mm):2760X1200X1800 <br>Process:<br>Panel loading mechanical contraposition IC loading automatically CCD <br>contraposition automatically and correction pre-bonding final bonding unloading automatically <br>
- COG Bonding Machine
- bonding machine
- heat seal machine
Production Capacity:
Not informed
Delivery Timeframe:
Not informed
Incoterms:
Not informedPackaging Details:
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More about
Shenzhen Liande Automation Equipment Co., Ltd
500-1000
Employees
10M - 50M
Sales volume (USD)
Not informed
1998
Year
Established
Business type
- Industry / Manufacturer
- Importer / Trading Company
Keywords
- ACF laminator
- heat bonding machine
- OCA laminator
- OCA vacuum lamination machine
- flex to rigid lamination machine
- FOG bonding machine
- COG bonding machine
- backlight assembly machine
- LCD assembly machine
- rigid to rigid lamination machine
- TP/LCD repair machine
- LCD refurbishment machine
- autoclave machine Ver Mais
Contact and location
-
David Zhang
-
+86 755 xxxxxxxx
-
Shenzhen city / | China
David Zhang
+86 755 xxxxxxxx
