Description
Gold OSP 0.2mm thickness PCB seamless splicing
Multilayer PCB, seamless splicing PCB
1) Thickness: 0.1mm-5mm
2) Minimum linewidth:0.075mm/3mil
3) Minimum gap:0.065/2.8mil
4) Minimum aperture inradium:0.15mm
5) Minimum aperture external diameter:0.45mm
6) Minimum BGA: 0.2mm
7) Layer:4 layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
More information you can views here
- Multilayer PCB
- seamless splicing PCB
Production Capacity:
80000
Delivery Timeframe:
Within 30 Days
Incoterms:
Not informedPackaging Details:
Customer settings
More about
HK CT TECH CO.,LIMITED
100-200
Employees
50M - 100M
Sales volume (USD)
100%
% Export sales
Year
Established
Business type
- Industry / Manufacturer
Keywords
- Multilayer PCB
Contact and location
- Edward Deng
- +86 186 xxxxxxxx
- Shenzhen / Guangdong | China